The microelectromechanical system (MEMS) is one of the most diversified fields of microelectronics; it is rated to be the\r\nmost promising technology of modern engineering. MEMS can sense, actuate, and integrate mechanical and electromechanical\r\ncomponents of micro- and nano sizes on a single silicon substrate using microfabrication techniques. MEMS industry is at the\r\nverge of transforming the semiconductor world into MEMS universe, apart from other hindrances; the reliability of these devices\r\nis the focal point of recent research. Commercialization is highly dependent on the reliability of these devices. MEMS requires a\r\nhigh level of reliability. Several technological factors, operating conditions, and environmental effects influencing the performances\r\nof MEMS devices must be completely understood.This study reviews some of the major reliability issues and failure mechanisms.\r\nSpecifically, the fatigue in MEMS is a major material reliability issue resulting in structural damage, crack growth, and lifetime\r\nmeasurements of MEMS devices in the light of statistical distribution and fatigue implementation of Paris� law for fatigue crack\r\naccumulation under the influence of undesirable operating and environmental conditions.
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